|Tue Jan 28 2014, 8:00am–1:00pm|
|Wed Jan 29 2014, 8:00am–1:00pm|
|Thu Jan 30 2014, 8:00am–1:00pm|
|Fri Jan 31 2014, 8:00am–1:00pm|
Additional fees may apply
DesignCon is the premier technical conference and exhibition for chip, board and systems design engineers involved in signal integrity in the high-speed communications and semiconductor communities.
Taking place over four days in Silicon Valley, DesignCon is the largest educational conference and technology exhibition for chip, board and systems design engineers in the high-speed communications and semiconductor communities.
With over 120 technical paper sessions, 3 keynotes, tutorials, industry panels, and emerging products 150+ top tier vendors, DesignCon brings engineers the latest theories, methodologies, applications and advanced design tools on signal and power integrity, jitter and crosstalk, test and measurement, parallel and memory interface design, ICs, semiconductor components and more – so they can discover new insights, solutions and tools, and drive their current and next-gen designs to success.
google glass, technology expo, power integrity, signal integrity, crosstalk, jitter, pcb tools, designcon, engineering conference, technology conference, intel, design engineering, engineering.
HOT SPRINGS CONVENTION CENTER, Hot Springs
Fri Aug 8 7:30am
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